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ULN2064B - ULN2066B ULN2068B - ULN2070B ULN2074B - ULN2076B
50V - 1.5A QUAD DARLINGTON SWITCHES
.OUTPUT .MI .SUSTAI .I .I .VERSI
CURRENT TO 1.5 A EACH DARLINGTON NIMUM BREAKDOWN 50 V NING VOLTAGE AT LEAST 35 V NTEGRAL SUPPRESSION DIODES (ULN2064B, ULN2066B, ULN2068B and ULN2070B) SOLATED DARLINGTON PINOUT (ULN2074B, ULN2076B) ONS COMPATIBLE WITH ALL POPULAR LOGIC FAMILIES
DESCRIPTION Designed to interface logic to a wide variety of high current, high voltage loads, these devices each contain four NPN darlington switches delivering up to 1.5 A with a specified minimum breakdown of 50 V and a sustaining voltage of 35 V measured at 100 mA. The ULN2064B, ULN2066B, ULN2068B and ULN2070B contain integral suppression diodes for inductive loads have common emitters. The ULN2074B and ULN2076B feature isolated darlington pinouts and are intended for applications such as emitter follower configurations. Inputs of the ULN2064B, ULN2068B and ULN2074B are compatible with popular 5 V logic families and the ULN2066B and ULN2076B are compatible with 615 V CMOS and PMOS. Types ULN2068B and ULN2070B include a predriver stage to reduce loading on the control logic. PIN CONNECTIONS AND ORDER CODES
POWERDIP 12 + 2 + 2
ULN2064B ULN2066B
ULN2068B ULN2070B
ULN2074B ULN2076B 1/8
September 2003
ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B
SCHEMATIC DIAGRAM
ULN2064B : RIN = 350 ULN2066B : RIN = 3k ULN2068B : RIN = 2.5k, Rs = 900 ULN2070B : RIN = 11.6k, Rs = 3.4k ULN2074B : RIN = 350 ULN2076B : RIN = 3k
ABSOLUTE MAXIMUM RATINGS
Symbol VCEX VCE(sus) IO Vi II Vs Ptot Tamb Tstg Output Voltage Output Sustaining Voltage Output Current Input Voltage Input Current Supply Voltage for ULN2068B for ULN2070B for ULN2066B - 2070B - 2074B - 2076B for ULN2064B - 2068B Parameter Value 50 35 1.75 30 15 25 10 20 4.3 1 - 20 to 85 - 55 to 150 Unit V V A V V mA V V W W C C
Power Dissipation at Tpins = 90 C at Tamb = 70 C Operating Ambient Temperature Range Storage Temperature
o ELECTRICAL CHARACTERISTICS (Tamb = 25 C unless otherwise specified )
Symbol ICEX
Parameter Output Leakage Current
Test Conditions VCE = 50V Tamb = 25C Tamb = 70C IC = 100mA, Vi = 0.4V IC IC IC IC = = = = 500mA 750mA 1A 1.25A IB IB IB IB = = = = 625A 935A 1.25mA 2mA
Min.
Typ.
Max. 100 500
Unit A A V V V V V mA mA mA mA mA mA mA mA
Fig. 1
VCE(sus) VCE(sat)
Collector-emitter Sustaining Voltage Collector-emitter Saturation Voltage
35 1.1 1.2 1.3 1.4 1.4 3.3 0.6 1.7 4.3 9.6 1.8 5.2 0.55 1.0 0.4 1.25
2 3 3 3 3 4 4 4 4 4 4 4 4
Ii(on)
Input Current
for ULN2064B and ULN2074B Vi = 2.4V Vi = 3.75V for ULN2066B and ULN2076B Vi = 5V Vi = 12V for ULN2068B Vi = 2.75V Vi = 3.75V for ULN2070B Vi = 5V Vi = 12V
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ELECTRICAL CHARACTERISTICS (Tamb = 25oC unless otherwise specified ) (continued)
Symbol Vi(on) Parameter Input Voltage Test Conditions VCE = 2V, IC = 1A ULN2064B, ULN2074B ULN2066B, ULN2076B VCE = 2V, IC = 1.5A ULN2064B, ULN2074B ULN2066B, ULN2076B ULN2068B ULN2070B for ULN2068B IC = 500mA, Vi = 2.75V for ULN2070B IC = 500mA, Vi = 5V 0.5 Vi to 0.5 Vo 0.5 Vi to 0.5 Vo for ULN2064B-ULN2066B and ULN2068B-ULN2070B VR = 50 V Tamb = 25C Tamb = 70C for ULN2064B-ULN2066B and ULN2068B-ULN2070B IF = 1 A IF = 1.5 A Min. Typ. Max. 2 6.5 2.5 10 2.75 5 6 4.5 1 1.5 Unit V V V V V V mA mA s s 6 50 100 A A 7 1.75 2 V V Fig. 5 5 5 5 5 5 8 8
Is
Supply Current
tPLH tPHL IR
Turn-on Delay Time Turn-off Delay Time Clamp Diode Leakage Current
VF
Clamp Diode Forward Voltage
Notes : 1. Input voltage is with reference to the substrate (no connection to any other pins) for the ULN2074B and ULN2076B reference is ground for all other types. 2. Input current may be limited by maximum allowable input voltage.
TEST CIRCUITS Figure 1. Figure 2.
Figure 3.
Figure 4.
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ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B
Figure 5. Figure 6.
Figure 7.
Figure 8.
Figure 9 : Input Current as a Function of Input Voltage.
Figure 10 : Input Current as a Function of Input Voltage.
Figure 11 : Collector Current as a Function of Input Current.
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ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B
MOUNTING INSTRUCTIONS The Rth j-amb can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Fig. 12) or to an external heatsink (Fig. 13). The diagram of Figure 14 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "" of two equal square copper areas having a thickness of 35 (1.4 mils). Figure 12 : Example of P.C. Board Area which is Used as Heatsink.
During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground.
Figure 13 : External Heatsink Mounting Example.
Figure 14 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side "".
Figure 15 : Maximum Allowable Power Dissipation vs. Ambient Temperature.
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ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B
TYPICAL APPLICATIONS Figure 16 : Common-anode LED Drivers.
Figure 17 : Common-cathode LED Drivers.
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DIM. MIN. a1 B b b1 D E e e3 F I L Z 0.38 0.51 0.85
mm TYP. MAX. MIN. 0.020 1.40 0.50 0.50 20.0 8.80 2.54 17.78 7.10 5.10 3.30 1.27 0.015 0.033
inch TYP. MAX.
OUTLINE AND MECHANICAL DATA
0.055 0.020 0.020 0.787 0.346 0.100 0.700 0.280 0.201 0.130
Powerdip 16
0.050
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2003 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com
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